Memberships strengthen SPARK’s engagement across the wireless and IoT ecosystems and support customers developing next-generation connected products
Montreal, Canada, August 11, 2026 – SPARK Microsystems, a Canadian fabless semiconductor company specializing in next-generation short-range wireless communications, today announced that it has joined the Bluetooth Special Interest Group (Bluetooth SIG) and the Connectivity Standards Alliance(CSA)
The memberships expand SPARK’s engagement with two global organizations, shaping the development and adoption of wireless connectivity and IoT standards. They will provide opportunities for SPARK to collaborate with industry leaders, remain aligned with evolving standards, and support customers developing increasingly sophisticated, connected products.
As consumer, industrial and medical devices increasingly combine sensing, positioning, real-time communication and intelligent processing, manufacturers often need to integrate multiple wireless technologies, each selected to meet specific performance requirements. SPARK’s LE-UWB™ (Low Energy Ultra-Wideband) technology addresses demanding use cases requiring ultra-low power consumption, high data throughput, exceptionally low latency, robust performance in congested RF environments and precise ranging capabilities.
“Next-generation connected products will increasingly rely on multiple wireless technologies, each selected for the capabilities it delivers best,” said Frederic Nabki, co-founder and Chief Technology Officer of SPARK Microsystems. “By joining Bluetooth SIG and the Connectivity Standards Alliance, SPARK is strengthening its ties with the broader wireless ecosystem. This will help us support customers as they integrate LE-UWB into product architectures that require greater responsiveness, longer battery life and reliable performance under demanding operating conditions.”
Bluetooth SIG is the international standards development organization responsible for advancing, protecting and promoting Bluetooth® technology. The Connectivity Standards Alliance brings together companies from across the IoT value chain to develop and promote open standards that enable connected products to interact securely.
SPARK’s new memberships build on its recent decision to join the FiRa® Consortium, which the company joined as an associate member in June 2026. Together, these initiatives reflect SPARK’s commitment to industry collaboration, standards alignment and the practical integration of advanced wireless technologies into next-generation consumer, industrial and medical devices.
About SPARK Microsystems
SPARK Microsystems is building next-generation short-range wireless communication devices for consumer, industrial and medical applications. Leveraging patented LE-UWB™ technology, SPARK delivers ultra-low-power, high-speed wireless connectivity with unmatched interference robustness and exceptionally low latency. LE-UWB™ technology is ideally suited for wearables, peripherals, tags, sensors, and other IoT-connected devices that require reliable, high-performance data communication, as well as ranging and positioning capabilities. SPARK makes it possible to minimize and ultimately eliminate wires and batteries across a wide range of AI and IoT applications. For more information, visit sparkmicro.com.
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SPARK MICROSYSTEMS and LE-UWB are trademarks or registered trademarks of SPARK Microsystems in Canada and/or other countries. All other trademarks are the property of their respective owners.
